元器件交易网讯 4月14日消息，据外媒报道，GforGames在微博上曝光了iPhone 6的制造模具和机壳设计草图。
然而不能确认图片的正确性，在过去几个月，已经曝光过许多其它图片。上月，微博上曝光另一组图片称是富士康正开发的iPhone 6机型。而日本杂志MacFan公布的设计图纸似乎是4.7英寸和5.7英寸的iPhone 6模型。据说其后又有图片曝光下一代iPhone外壳设计与此设计图纸一致。
A new set of leaks showing alleged manufacturing molds and chassis sketches of the iPhone 6 have surfaced on Chinese microblogging site Weibo [Google Translate, viaGforGames].
The photos are said to come from a factory belonging to Apple manufacturing partner Foxconn, as the first set of images show very detailed drawings of the chassis for a smartphone-type device, while the second set images are said to be of the manufacturing die used for Apple"s next-generation iPhone.
While the validity of the images cannot be confirmed, the leak follows a number of others in the past few months. Last month, another set of images posted on Weibo depicted an alleged iPhone 6 model under development at Foxconn, while Japanese magazine MacFanpublished alleged design drawings of what appeared to be 4.7-inch and 5.7-inch iPhone 6 models. This was followed by a photo reportedly showing cases designed for the larger next-generation iPhone that were consistent with the design drawings.
Apple is expected to ship the iPhone 6 later this year, which has been heavily rumored to come in two different sizes: 4.7 inches and 5.5 inches. Recent reports have noted that the smaller 4.7 inch version will ship in the third quarter of 2014, while the larger version may ship later this year or early next year due to production challenges.
Along with a larger screen, both models of the next-generation iPhone are said to includea thinner design, new A8 processor, Touch ID fingerprint sensor, 1GB of RAM, and an improved camera with optical image stabilization.